Calibração do sensor do Tt lan fire

toinho_al

Saudações...

Estou com o gabinete da Thermaltake, o XaserIII Lan Fire da assinatura. O display do hardcano que mos...

toinho_al

Como não devo colocar o sensor em cima do die mesmo que coloque bem próximo acho que sempre vai faltar aquele offset ...

Mais Um

A temperatura é medida pela diferenca de resistencia entre os fios do termopar, se vc colocar uma resistencia em seri...

toinho_al

Não é melhor usar um potenciometro?

Figure 5. Desired Thermocouple Location
3. After the marks are scribed, clean the desired thermocouple attach location with a mild
solvent and a lint-free wipe or cloth. Alcohol or acetone should suffice. Cleanliness of the part
is critical for a strong epoxy bond after curing.
4. With thermocouple (T/C) in hand, locate the junction and straighten the wire by hand so that
the first 4–6 inches are reasonably straight. Use the fine point tweezers to ensure that the bead
and the two protruding wires are straight and untwisted. Ensure the second layer of
thermocouple insulation, sometimes clear, is not covering the bead.
5. Place a slight downward bend (~30°) in the protruding wires approximately 1/16 inch from
junction using the tweezers. This aids the user in ensuring the thermocouple junction contacts
the heat spreader surface.
6. Place the thermocouple on the surface of the part so the bead is contacting the IHS at the
desired location. Hold the T/C with one hand and use a pair of tweezers to apply a cut piece
of Kapton* tape across the wire approximately about ¼ inch back from the bead. Apply
pressure to the tape to ensure a good bond. Apply additional Kapton tape along the length of
the wire to ensure a good temporary bond to the part. (See following Figure 6). Check for
electrical continuity between the thermocouple and the IHS using a multimeter. If there
is no electrical continuity between the thermocouple and the IHS, remove the thermocouple
and repeat Steps 4–6.
Thermal Specifications
R
Intel® Pentium® 4 Processor Thermal Design Guide 23
Figure 6. Location of Kapton* Tape for Temporary Bond
7. With the thermocouple temporarily held to the part, apply epoxy to the thermocouple bead for
a permanent bond. If applying Omegabond 101 epoxy, a small piece of paper works well for
mixing. Follow the manufacturer’s instructions for mixing.
8. Use the Exacto* knife or similar to apply the epoxy to the thermocouple bead. Dab glue on
the bead and the exposed wires. Use only the appropriate amount of epoxy to cement the
thermocouple to the IHS. Excess epoxy will prevent the heatsink from mating flush with the
IHS. The entire bead should be submerged and it is best to have insulated wires protruding
from the epoxy. (See following Figure 7).